PCB type "Package with Via Holes"
Formation of solder fillets through special processing! A package using patented technology.
The "Package with Via Holes" utilizes a patented technology that allows for the reliable formation of solder fillets through special processing of the terminal parts, achieving high soldering quality and improved visual inspection after mounting. In standard non-lead packages, there are no terminals on the edge of the PCB, so fillets cannot be formed. Additionally, due to the formation of via holes, solder spreads from the plated area of the via holes, resulting in a package that offers reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ High soldering quality and improved visual inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.
- 企業：アルス株式会社 本社工場、第2～第5工場
- 価格：Other
